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  ? semiconductor components industries, llc, 2000 october, 2000 rev. 1 1 publication order number: mbrp20060ct/d mbrp20060ct preferred device powertap ? ii switchmode ? power rectifier . . . using the schottky barrier principle with a platinum barrier metal. these stateoftheart devices have the following features: ? dual diode construction e may be paralleled for higher current output ? guardring for stress protection ? low forward voltage ? 175 c operating junction temperature mechanical characteristics: ? case: epoxy, molded with metal heatsink base ? weight: 80 grams (approximately) ? finish: all external surfaces corrosion resistant ? top terminal torque: 2540 lbin max ? base plate torques: see procedure given in the package outline section ? shipped 25 units per foam ? marking: b20060t maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 60 v average rectified forward current (rated v r , t c = 140 c) per leg per device i f(av) 100 200 a peak repetitive forward current, (rated v r , square wave, 20 khz, t c = 140 c) per leg i frm 200 a nonrepetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 1500 a peak repetitive reverse current (2.0  s, 1.0 khz) per leg i rrm 2.0 a storage temperature range t stg 55 to +150 c operating junction temperature t j 55 to +150 c voltage rate of change (rated v r ) dv/dt 10,000 v/  s schottky barrier rectifier 200 amperes 60 volts device package shipping ordering information mbrp20060ct powertap ii 25 units/tray powertap ii case 357c plastic http://onsemi.com 1 2 3 1 2 3 preferred devices are recommended choices for future use and best overall value. marking diagram b20060t b20060t = device code yy = year ww = work week yyww
mbrp20060ct http://onsemi.com 2 thermal characteristics (per leg) rating symbol value unit thermal resistance, junction to case r q jc 0.6 c/w electrical characteristics (per leg) instantaneous forward voltage (note 1.) (i f = 200 amps, t j = 25 c) (i f = 200 amps, t j = 100 c) v f 0.91 0.80 volts instantaneous reverse current (note 1.) (rated dc voltage, t j = 125 c) (rated dc voltage, t j = 25 c) i r 50 0.5 ma 1. pulse test: pulse width = 300 m s, duty cycle  2.0%. figure 1. typical forward voltage figure 2. maximum forward voltage v f , instantaneous forward voltage (volts) i f , instantaneous forward current (amps) 0.4 0.3 0.2 v f , maximum instantaneous forward voltage (volts) 1000 100 10 1.0 0.6 0.5 0.8 0.7 0.3 0.2 1000 100 10 1.0 0.5 0.4 0.7 0.6 i f , instantaneous forward current (amps) t j = 150 c t j = 150 c 0.8 0.9 0.9 1.0 100 c 25 c 100 c 25 c
mbrp20060ct http://onsemi.com 3 i r , maximum reverse current (amps) i r , reverse current (amps) figure 3. typical reverse current figure 4. maximum reverse current figure 5. current derating (per leg) figure 6. forward power dissipation (per leg) 01020 01020 30 30 i o , average forward current (amps) v r , reverse voltage (volts) t c , case temperature ( c) v r , reverse voltage (volts) 100 0 0 20 25 100 50 75 125 40 80 60 150 175 120 140 0 0 60 40 20 20 100 40 60 80 80 100 120 140 160 160 120 0.0001 0.001 0.01 0.1 1.0 0.0001 0.001 0.01 0.1 1.0 0.000001 p fo , average power dissipation (watts) i o , average forward current (amps) 100 c t j = 150 c 100 c 25 c t j = 150 c square wave dc ipk/io =  ipk/io = 5 ipk/io = 10 ipk/io = 20 square wave dc ipk/io =  ipk/io = 5 ipk/io = 10 ipk/io = 20 freq = 20 khz 0.00001 40 50 60 40 50 60 0.00001 25 c
mbrp20060ct http://onsemi.com 4 figure 7. capacitance figure 8. thermal response figure 9. test circuit for repetitive reverse current 100 1.0 v r , reverse voltage (volts) c, capacitance (pf) t j = 25 c 2n6277 100 2n2222 + 150 v, 10 madc v cc 12 vdc current amplitude adjust 0-10 amps 12 v 100  carbon 1 carbon 1n5817 4  f d.u.t. 2 k  2  s 1 khz 10,000 1,000 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 0.001 0.01 0.1 t, time (s) , transient thermal resistance (normalized) r (t) + 10 100 r tjc(t) = r tjc*r(t) 1.0
mbrp20060ct http://onsemi.com 5 maximum mechanical ratings terminal penetration: 0.235 max terminal torque: 2540 in-lb max mounting torque e outside holes: 3040 in-lb max mounting torque e center hole: 810 in-lb max seating plane 1 mil per in. flatness (between mounting holes) powertap mechanical data applies over operating temperature vertical pull 250 lbs. max 2 in. lever pull 50 lbs. max note: while the powertap is capable of sustaining these vertical and levered tensions, the intimate contact note: between powertap and heat sink may be lost. this could lead to thermal runaway. the use of very note: flexible leads is recommended for the anode connections. use of thermal grease is highly recommended. 2 mounting procedure the powertap package requires special mounting considerations because of the long longitudinal axis of the copper heat sink. it is important to follow the proper tightening sequence to avoid warping the heat sink, which can reduce thermal contact between the powertap and heat sink. 23 turns 23 turns 23 turns power tap heat sink step 2: finger tighten the center bolt. the bolt may catch on the threads of the heat sink so it is important to make sure the face of the bolt or washer is in contact with the surface of the powertap. 23 turns finger-tight 23 turns power tap heat sink step 3: tighten each of the end bolts between 5 to 10 in-lb. power tap heat sink 510 in-lb finger-tight 510 in-lb step 4: tighten the center bolt between 8 to 10 in-lb. 510 in-lb 810 in-lb 510 in-lb power tap heat sink step 5: finally, tighten the end bolts between 30 to 40 in-lb. 3040 in-lb 810 in-lb 3040 in-lb power tap heat sink step 1: locate the powertap on the heat sink and start mounting bolts into the threads by hand (2 or 3 turns).
mbrp20060ct http://onsemi.com 6 package dimensions case 357c03 powertap plastic package issue e b 0.25 (0.010) m ta mm dim a min max min max millimeters 3.450 3.635 87.63 92.33 inches b 0.700 0.810 17.78 20.57 c 0.615 0.640 15.63 16.26 e 0.120 0.130 3.05 3.30 f 0.435 0.445 11.05 11.30 g 1.370 1.380 34.80 35.05 h 0.007 0.030 0.18 0.76 n 1/4-20unc-2b 1/4-20unc-2b q 0.270 0.285 6.86 7.23 r 31.50 bsc 80.01 bsc u 0.600 0.630 15.24 16.00 v 0.330 0.375 8.39 9.52 w 0.170 0.190 4.32 4.82 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. terminal penetration: 5.97 (0.235) maximum. r g w n q b 0.25 (0.010) m ta mm 2 pl e seating plane f v u c h a b t
mbrp20060ct http://onsemi.com 7 notes
mbrp20060ct http://onsemi.com 8 on semiconductor and are trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scill c data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthori zed use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. publication ordering information central/south america: spanish phone : 3033087143 (monfri 8:00am to 5:00pm mst) email : onlitspanish@hibbertco.com tollfree from mexico: dial 018002882872 for access then dial 8662979322 asia/pacific : ldc for on semiconductor asia support phone : 3036752121 (tuefri 9:00am to 1:00pm, hong kong time) toll free from hong kong & singapore: 00180044223781 email : onlitasia@hibbertco.com japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. mbrp20060ct/d powertap and switchmode are trademarks of semiconductor components industries, llc. north america literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com fax response line: 3036752167 or 8003443810 toll free usa/canada n. american technical support : 8002829855 toll free usa/canada europe: ldc for on semiconductor european support german phone : (+1) 3033087140 (monfri 2:30pm to 7:00pm cet) email : onlitgerman@hibbertco.com french phone : (+1) 3033087141 (monfri 2:00pm to 7:00pm cet) email : onlitfrench@hibbertco.com english phone : (+1) 3033087142 (monfri 12:00pm to 5:00pm gmt) email : onlit@hibbertco.com european tollfree access*: 0080044223781 *available from germany, france, italy, uk, ireland


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